American Mentor Technology announced that it has become the JEDEC (Joint Electron Device Engineering Council) standard based on the semiconductor thermal resistance detection method proposed by the company's MicReD department and the German Infineon Technologies Automotive Power Application Department in 2005. The method is mainly applied to the fields of power semiconductors and LEDs , and is used for a single heat dissipation path.
The corresponding specifications were identified as "JESD51-14" by the JEDEC JC15 committee, which was managed by the semiconductor package thermal evaluation technology in November 2010. The standard is named: "A double-sided transient detection method for detecting the thermal resistance between a junction (a device's junction) and a shell (note: a package's outer casing) when heat flows through a single-path semiconductor device."
This standard (and the method jointly published by Mentor and Infineon in 2005) is based on the following technologies introduced by MicReD:
(1) Static transient thermal resistance detection technology (has become JEDEC51-1 standard);
Note: Use the T3Ster (top right) thermal resistance test method. First, use T3Ster to find the time distribution of temperature (left). Then use the relevant software to convert the time distribution information into a constructor (right). (click on the image to enlarge)
(2) The constructor (function or graph showing the thermal resistance-heat capacity relationship) is derived using the time-temperature distribution information obtained by the technique.
Note: The meaning of the constructor. Represents the thermal construction of a packaged device as an object. Image courtesy of Mentor. (click on the image to enlarge)
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