GE Sun Hui: LED road lighting is ready

On March 20th, the 5th LED Industry Theme Summit Forum was successfully concluded at Dongli Lake Hotel in Dongli District, Tianjin. The forum was organized by domestic well-known industry research, media organization Gaogong LED and Tianjin Dongli District People's Government, Tianjin. The city's Science and Technology Committee co-hosted nearly 300 industry leaders from across the country to participate in the forum. Speakers include Zhang Youhui, Secretary of Tianjin Dongli District, Chen Yansheng, Chairman of China Lighting Association, and Guan Baiyu, Deputy Inspector of Electronic Information Department of Ministry of Industry and Information Technology. Senior executives from industry bodies and governments, as well as Tang Guoqing, general manager of CREE China Market, Dr. Zong Mingcheng, Director of Solid State Lighting Standardization, Philips Lighting Asia Pacific, Yang Lan, Senior Sales Manager of OSRAM, Sun Hui, GE Systems Engineering Manager, and other international giants. There are many representatives and investors of domestic LED business leaders. The forum attracted nearly 300 high-level representatives from 136 companies in the LED industry in 19 provinces, cities and regions across the country.

The topics of this forum cover the hot topics of current LED industry such as market opportunities, technology trends, and ten cities: semiconductor lighting technology and market forecast, LED street light technology, EMC and patent risks and countermeasures, LED market in 2010 Features and competitive factors, etc., including LED technology and all aspects of the market. Such as: semiconductor lighting technology, market status and outlook; LED lighting and standardization; EMC opportunities and risks; LED street lamp structure and system design; LED enterprise financing, listing issues to pay attention to. Dai Dongqiang, deputy head of the Dongli District of Tianjin, introduced the investment environment of Dongli District and the planning of the high-tech industrialization base of the national semiconductor lighting project. The experts at the meeting expressed their views and made a thorough and in-depth discussion on all aspects of the LED industry.

In his speech, Sun Hui, GE Systems Engineering Manager, analyzed our current market concerns about LED road lighting: LED road/tunnel lighting is energy-saving, and whether the user's investment can be rewarded. He believes that LED is already ready for road lighting, because the vertical illumination of LED street lights improves the recognition of the face and surrounding objects, greatly improves the perimeter lighting control, effectively reduces light spillage, and makes the urban environment more healthy and harmonious.

Sun Hui explained his views to the market. He pointed out that the savings in operating costs of lighting systems are not just electricity bills, but the return on investment of customers depends more on the long-term reliable operation of the lighting system. He also warned the people present that LEDs are used in lighting to see what is suitable for LED applications. Compared with traditional technologies, LEDs are competitive in this application, including reliability/lifetime, lighting quality, customer return on investment, etc., not all. Applications are suitable for LEDs, such as the application of LED lighting in the stadium is not suitable, the return on investment is not high, and some of the lighting requirements are not suitable. He emphasized the need to do a good job in system design for LED road lighting to understand the application requirements. The product architecture is simple but the details are crucial.

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Silicone Thermal Conductive Gap Filler Pad

Thermal Conductive Pad1

Thermal Conductive Gap Filler Pad

TP-600


TEST ITEM

TEST MOTHOD

UNIT

VALUE

SIZE


mm

400*200MM

COLOR

Visual


 Blue

THICKNESS

ASTM D374

mm

0.3-10MM

GRAVITY

ASTM D792

g/cc

2.85±0.1

HARDNESS

ASTM D2240

Shore 00

25±5

TENSILE STRENGTH

ASTM D412

kg/cm2

55

 

 

 

ELONGATION

ASTM D412

%

60 95

TEMP

EN344

℃

-40~+220

VOLUME RESISTIVITY

ASTM D257

Ω•CM

3.1*1011

BREAKDOWN VOLTAGE

ASTM D149

kv/mm

5

VOLUME IMPENDENCE

ASTM D257

Ω.cm

1.7×1013

Weight Damnify

 200℃ 200H

%

≤1

Thermal Resistance

ASTM D5740

℃/ W

0.18

FLAMMABLITY

UL-94


V-0

THERMAL CONDUCTIVITY

ASTM D5470

w/(m•k)

6


TP-240


TEST ITEM

TEST MOTHOD

UNIT

VALUE

COLOR

Visual


GRAY

THICKNESS

ASTM D374

mm

0.5~10

GRAVITY

ASTM D792

g/cc

1.8-2.2

HARDNESS

ASTM D2240

Shore00

30±5

TENSILE STRENGTH

ASTM D412

kg/cm2

2.3




TEMP

EN344

℃

-40~+220

VOLUME RESISTIVITY

ASTM D257

Ω•CM

1.7*1013

BREAKDOWN VOLTAGE

ASTM D149

kv/mm

4

FLAMMABLITY

UL-94


V-0

THERMAL CONDUCTIVITY

ASTM D5470

w/(m•k)

2.4


Fiber glass reinforced


Test Item

 Unit  

 Data  

 Test Method  


   Color  

 -----

 gray\pink

  Visual


Reinforcement Carrier


fiber glass



  Thickness  

 mm  

 0.23\0.3\0.45mm±0.05  

 ASTM  

 D374  

  Spec  

 mm  

 300mm×50M  

 ASTM  

 D1204  

  Density  

 g/cc  

 1.7±0.1  

 ASTM  

 D792  

  Hardness  

 Shore 00  

 75±5  

 ASTM  

 D2240  

Tensile Strength  

 kg/cm2  

 >180  

 ASTM  

 D412  

 pa  

 1.8*1011  

 ASTM  

 D412  


 Breakdown Voltage  

 Kv/mm  

 â‰¥4.0  

 ASTM  

 D149  

Volume Impedance  

 Î©.cm  

 1.7×1013  

 ASTM  

 D257  

Continuous Use Temp  

 â„ƒ

  -40~220  

 EN344  


Thermal Resistance  

 â„ƒ/ W  

 0.25  

 ASTM  

 D5740  

Flame Rating  

 ------

 V-0  

 UL

  94  

 Thermal Conductivity  

 W/m.k  

 1.0  

 ASTM  

 E 1461-01  


Thermal Conductive Pad

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