On March 20th, the 5th LED Industry Theme Summit Forum was successfully concluded at Dongli Lake Hotel in Dongli District, Tianjin. The forum was organized by domestic well-known industry research, media organization Gaogong LED and Tianjin Dongli District People's Government, Tianjin. The city's Science and Technology Committee co-hosted nearly 300 industry leaders from across the country to participate in the forum. Speakers include Zhang Youhui, Secretary of Tianjin Dongli District, Chen Yansheng, Chairman of China Lighting Association, and Guan Baiyu, Deputy Inspector of Electronic Information Department of Ministry of Industry and Information Technology. Senior executives from industry bodies and governments, as well as Tang Guoqing, general manager of CREE China Market, Dr. Zong Mingcheng, Director of Solid State Lighting Standardization, Philips Lighting Asia Pacific, Yang Lan, Senior Sales Manager of OSRAM, Sun Hui, GE Systems Engineering Manager, and other international giants. There are many representatives and investors of domestic LED business leaders. The forum attracted nearly 300 high-level representatives from 136 companies in the LED industry in 19 provinces, cities and regions across the country.
The topics of this forum cover the hot topics of current LED industry such as market opportunities, technology trends, and ten cities: semiconductor lighting technology and market forecast, LED street light technology, EMC and patent risks and countermeasures, LED market in 2010 Features and competitive factors, etc., including LED technology and all aspects of the market. Such as: semiconductor lighting technology, market status and outlook; LED lighting and standardization; EMC opportunities and risks; LED street lamp structure and system design; LED enterprise financing, listing issues to pay attention to. Dai Dongqiang, deputy head of the Dongli District of Tianjin, introduced the investment environment of Dongli District and the planning of the high-tech industrialization base of the national semiconductor lighting project. The experts at the meeting expressed their views and made a thorough and in-depth discussion on all aspects of the LED industry.
In his speech, Sun Hui, GE Systems Engineering Manager, analyzed our current market concerns about LED road lighting: LED road/tunnel lighting is energy-saving, and whether the user's investment can be rewarded. He believes that LED is already ready for road lighting, because the vertical illumination of LED street lights improves the recognition of the face and surrounding objects, greatly improves the perimeter lighting control, effectively reduces light spillage, and makes the urban environment more healthy and harmonious.
Sun Hui explained his views to the market. He pointed out that the savings in operating costs of lighting systems are not just electricity bills, but the return on investment of customers depends more on the long-term reliable operation of the lighting system. He also warned the people present that LEDs are used in lighting to see what is suitable for LED applications. Compared with traditional technologies, LEDs are competitive in this application, including reliability/lifetime, lighting quality, customer return on investment, etc., not all. Applications are suitable for LEDs, such as the application of LED lighting in the stadium is not suitable, the return on investment is not high, and some of the lighting requirements are not suitable. He emphasized the need to do a good job in system design for LED road lighting to understand the application requirements. The product architecture is simple but the details are crucial.
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Silicone Thermal Conductive Gap Filler Pad could reach 6.0 W/mk Between heat-generation Component and heatsink Automotive engine control, Graphices Cards, Telecom device Wireless Hub,Military equipment, power supply Cooling Module, Thermal module,
1. High bond strength to surfaces
2. Thermal conductivity in combination with electrical isolation
3. Excellent wet out
4. High temperature stability
Application:
1.For CPU, LED,PPR heat sink, microprocessor
2.For any power consumption semiconductor
2.Replacing screws, fasteners and other fixed means
4.Fixing heat sink on the power supply circuit board
5.Fixing heat sink on vehicle control circuit board
6.Fixing heat sink on packaged chips
we could die cut any size and shapes as customer design.
TP-600
TEST ITEM
TEST MOTHOD
UNIT
VALUE
SIZE
mm
400*200MM
COLOR
Visual
Blue
THICKNESS
ASTM D374
mm
0.3-10MM
GRAVITY
ASTM D792
g/cc
2.85±0.1
HARDNESS
ASTM D2240
Shore 00
25±5
TENSILE STRENGTH
ASTM D412
kg/cm2
55
ELONGATION
ASTM D412
%
60 95
TEMP
EN344
℃
-40~+220
VOLUME RESISTIVITY
ASTM D257
Ω•CM
3.1*1011
BREAKDOWN VOLTAGE
ASTM D149
kv/mm
5
VOLUME IMPENDENCE
ASTM D257
Ω.cm
1.7×1013
Weight Damnify
200℃ 200H
%
≤1
Thermal Resistance
ASTM D5740
℃/ W
0.18
FLAMMABLITY
UL-94
V-0
THERMAL CONDUCTIVITY
ASTM D5470
w/(m•k)
6
TP-240
TEST ITEM
TEST MOTHOD
UNIT
VALUE
COLOR
Visual
GRAY
THICKNESS
ASTM D374
mm
0.5~10
GRAVITY
ASTM D792
g/cc
1.8-2.2
HARDNESS
ASTM D2240
Shore00
30±5
TENSILE STRENGTH
ASTM D412
kg/cm2
2.3
TEMP
EN344
℃
-40~+220
VOLUME RESISTIVITY
ASTM D257
Ω•CM
1.7*1013
BREAKDOWN VOLTAGE
ASTM D149
kv/mm
4
FLAMMABLITY
UL-94
V-0
THERMAL CONDUCTIVITY
ASTM D5470
w/(m•k)
2.4
Fiber glass reinforced
Test Item
Unit
Data
Test Method
Color
-----
gray\pink
Visual
Reinforcement Carrier
fiber glass
Thickness
mm
0.23\0.3\0.45mm±0.05
ASTM
D374
Spec
mm
300mm×50M
ASTM
D1204
Density
g/cc
1.7±0.1
ASTM
D792
Hardness
Shore 00
75±5
ASTM
D2240
Tensile Strength
kg/cm2
>180
ASTM
D412
pa
1.8*1011
ASTM
D412
Breakdown Voltage
Kv/mm
≥4.0
ASTM
D149
Volume Impedance
Ω.cm
1.7×1013
ASTM
D257
Continuous Use Temp
℃
-40~220
EN344
Thermal Resistance
℃/ W
0.25
ASTM
D5740
Flame Rating
------
V-0
UL
94
Thermal Conductivity
W/m.k
1.0
ASTM
E 1461-01
Thermal Conductive Pad
Thermal Conductive Pad,Thermal Pad Material,Thermal Interface Pad,Thermal Conductive Gap Pad
JINAN EMI SHIELDING TECHNOLOGY CO., LTD. , http://www.emirfi.com